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Two-Sided Component Mounting

IP.com Disclosure Number: IPCOM000063475D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Asselta, JA Macek, JS [+details]

Abstract

In order to give a general engineering change (EC) capability, a method is required that prevents interference between any external EC wires and associated components. This is accomplished by separating the EC and component areas, and by doing all EC work on one plane. This article describes a means of mounting components, such as modules, I/O's and cards, to two sides of a printed circuit board with EC capability. The EC plane of a printed circuit board (Fig. 1) is shown for a partial card socket requiring a width of four pins and any desired length. The solder pad 11 sits on the surface of the plane with no internal connections beneath it. A connector is surface soldered to pad 11, which is then connected to the EC pad 12 and signal hole 13 by means of the surface printed circuit line.