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Standard Solder Pad Layout for Surface-Mounted Devices

IP.com Disclosure Number: IPCOM000063539D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Yarlott, JM [+details]

Abstract

A printed circuit board layout to accommodate surface-mounted devices, such as the ceramic resistor 11, is shown in Fig. 1 in which the solder pad layout has been standardized in both the location and size of the pad. The pads 10 are rectangular in shape, measuring .024 by .074 inch and placed relative to a 50-mil grid 13 so that the narrow sides 14 of the pad 10 are centered lengthwise relative to a pair of adjacent grid intersections 15. A via hole 16 may be provided at a grid intersection to accommodate multiplanar wiring. The illustrated layout maximizes the wirability of the board and lends itself to design automation. On any board the pads may be all aligned in one direction, or certain pads may be rotated 90Πrelative to the other pads.