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Improved Air Cooling by Management of Boundary Layer of Air

IP.com Disclosure Number: IPCOM000063578D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Buller, L Hoehmann, H [+details]

Abstract

Figs. 1 and 2 illustrate a full planar card 10, approximately 10 by 15 inches, for circuit components such as modules 11. The card or board 10 is reinforced for rigidity by a cover 13. To strengthen the package a set of webs 14 is molded into the cover 13. These webs can change the cooling capability by managing the air flow through the plastic reinforced package. The air flow 15 in the system is directed onto the modules 11 by molding a curve 16 into the webs 14, as shown in Fig .3. The effect on the downward flow of air onto the module is an impingement stream that reduces the size of the thermal boundary layer and creates a turbulent condition that improves cooling. The curved webs also increases the velocity of the air at that point which aids cooling.