Low Inductance Microconnector for Testing Thin Film Parts at Cryogenic Temperatures
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18
This test connector meets all the requirements of a connector to be used in testing high speed cryo-electronics. It is a dry wiping contact which applies a uniform force to all pads without damaging them, it is reuseable, and it has the low inductance typical of controlled collapse chip connector geometries. Low temperature (4.2K - 77K) testing of high speed circuit chips and silicon package parts is required for cryogenic electronic technologies. Reliable contact to high density controlled collapse chip connector arrays must be made with a low inductance (< 50 pH) connector. State-of-the-art testing now uses either contact arrays or microspheres soldered to a mating thin film part.