Browse Prior Art Database

Low Inductance Microconnector for Testing Thin Film Parts at Cryogenic Temperatures

IP.com Disclosure Number: IPCOM000063614D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Bickford, HR Flint, EB Grebe, KR [+details]

Abstract

This test connector meets all the requirements of a connector to be used in testing high speed cryo-electronics. It is a dry wiping contact which applies a uniform force to all pads without damaging them, it is reuseable, and it has the low inductance typical of controlled collapse chip connector geometries. Low temperature (4.2K - 77K) testing of high speed circuit chips and silicon package parts is required for cryogenic electronic technologies. Reliable contact to high density controlled collapse chip connector arrays must be made with a low inductance (< 50 pH) connector. State-of-the-art testing now uses either contact arrays or microspheres soldered to a mating thin film part.