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Improvement of Bond Between Copper and Ceramics

IP.com Disclosure Number: IPCOM000063621D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Braren, BE Brownlow, JM Srinivasan, R [+details]

Abstract

Metal pastes are applied to unfired and fired ceramics in the fabrication of circuit modules. Often, the bond between the metal and ceramic is poor due to poor adhesion between the metal and the underlying ceramic. In order to improve the adhesion, laser irradiation with far-UV light produces a rough surface that becomes very highly interlocked with the applied metal pastes. After firing, a very strong bond is created. A green sheet or a laminated green sheet of the type used for ceramic metal circuit modules can be used.