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Method for Rapid Plating of Printed Circuit Boards

IP.com Disclosure Number: IPCOM000063640D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Fowler, AB Hodgson, RT von Gutfeld, RJ [+details]

Abstract

This method increases the rate of plating metal connectors on printed circuit boards, by using an array of high intensity lamps in parallel. Metal connectors on printed circuit boards are typically electroplated with gold to a thickness of about 2 micrometers. Typical deposition rates in the absence of any technique to accelerate this rate are of the order of 100-200 x 104 micrometers (10-20 nm)/sec. Thus plating can take 100 sec. Heating the region to be plated with a laser can increase the plating rate to as high as 10-12 micrometers/sec. However, in many cases the area to be plated is larger than can be heated by a laser. Further, laser plating is a serial process which would have to move from connector to connector. Fig. 1 is a view of a board 10 behind a mask 21. Fig.