Chip Rework on Multilayer Ceramic Recess
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18
A chip rework technique for the chip extraction from a multilayer ceramic structure (MLC) involves the removal of the majority of solder remnants left at the ceramic recess at each controlled collapse chip connection (C4) site and then the refilling of these ceramic recesses with solder, prior to joining the replacement chip. A porous copper block 12 (Fig. 1) is applied to remove all solder lying above the top ceramic surface 11 and to remove some solder below the surface. A reusable, modified copper block 12 is manufactured by laminating a thick photo-polymer (not shown) to the surface of a copper block.