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Large Area Laser-Enhanced Plating

IP.com Disclosure Number: IPCOM000063654D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
von Gutfeld, RJ [+details]

Abstract

Large area laser-enhanced plating (LALEP) provides a means for obtaining selective plating at a rapid rate and avoids absorption and reflectivity of the plated material, by heating the back of a substrate opposite the point where a plating jet is applied to the front of the substrate. This method utilizes the fact that for thin foils, typically on the order of a few mils thick, as is the case for most connectors, it is possible to achieve nearly equal temperatures on the front and back of the material in times on the order of milliseconds of laser radiation.