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Dry Soldering Process Using Halogenated Gas

IP.com Disclosure Number: IPCOM000063730D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Davidson, A Moskowitz, PA Ray, SK Yeh, HL [+details]

Abstract

This article relates generally to soldering and, more particularly, to reflowing and bonding using a halogenated gas atmosphere to eliminate the need for liquid solder fluxes. By performing reflow soldering in a gaseous environment comprising an admixture of a gas reactive with solder oxide and an inert carrier gas, the need for liquid solder fluxes becomes unnecessary. Circuit chips can be attached by soldering in batch processing by heating the chips above the melting point of the solder in an atmosphere of a carrier gas, such as argon, containing an admixture of a reactive gas, such as dichlorodifluoromethane (CCl2F2). The elevated temperature produces a reduction of the solder oxide by the reactive gas and subsequently the solder reflows.