Two-Layer Deep-Ultraviolet Portable Masking Resist System Using a Conformable Mold for the Imaging Layer
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-18
This article relates generally to processes for forming, exposing and developing photoresists and more particularly to a two-layer photoresist system wherein the process tolerance and resist profile are improved by incorporating a mold during a resist-hardening step. A typical two-layer deep-UV portable conformable mold system uses a novolak-based resist as the top imaging layer, because it is a widely adopted single-layer resist for manufacturing and it is sufficiently opaque to serve as a deep-UV blanket exposure mask for the subsequent delineation of an underlying resist layer. The underlying layer can be any of a number of well-known deep-UV resists, such as polymethyl methacrylate (PMMA) or the terpolymer of methyl methacrylate (MMA) and methacrylic acid (MAA).