Browse Prior Art Database

Foil-Pinned Module Surface Mounting Technique

IP.com Disclosure Number: IPCOM000063814D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Marks, R Phelps, DW Samuelsen, SJ Ward, WC [+details]

Abstract

Using a high temperature composite universal carrier tape, i.e., a copper alloy on polyimide, resilient foil pins are fabricated for the purpose of surface mounting components with thermal mismatch between component and carrier, i.e., card, board. The method of fabrication starts with forming and tinning thin, isolated lines in the copper alloy of the composite carrier (Fig. 1). "L"-shaped foil pins are formed by punching through the composite carrier in the desired contact pattern (Fig. 2). The composite carrier is then aligned to bond sites on the component and soldered to these sites (Fig. 3). The "L"-shaped pins are then formed into a "C" shape to provide a flexible, resilient member for attachment to the card, board, etc. (Fig. 4).