Browse Prior Art Database

Heat Pipe Pin Fin Cap

IP.com Disclosure Number: IPCOM000063822D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Stutzman, RJ [+details]

Abstract

This article describes a method for removing heat from a high power module, such as a thermally conductive module (TCM). Heat generated from the chips 1 in the TCM 2 is conducted from the chips 1 to the pin fins 3, then dissipated from the pin fins to the air. Unique in this design is the use of heat pipes for the pin fins, which conduct the heat from the base to the air more efficiently then other solid metal pins. Attachment of the pins to the base can be made by threading the pin or press fitting the fin to the base. A hybrid heat sink alternatively can be used in which a cap with a matrix of metal pins would have heat pipe pin fins included in it, thus augmenting the total heat transfer. The number and size could be optimized for cost and effectiveness.