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Chip-To-Chip Cable Connection

IP.com Disclosure Number: IPCOM000063838D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Korth, HE Kulcke, W [+details]

Abstract

A chip-to-chip cable connection is described which is produced in one piece, using silicon micromechanics, which permits producing contours with straight and oblique anisotropically etched walls and applying or embedding conductors in a doping step. Flexible reeds and flat cable substrates may be produced by thin etching. An example of a detachable plug connector for a chip 1 is shown in Fig. 1. Chip 1 is processed such that its lateral walls 2 are obliquely ground. Walls 2 are each provided with a small recess 3. Walls 2 and front wall 4 permit plug 5 being accurately positioned. Plug 5, integrated in the connector element, consists of a block 6 supporting the individual function elements and permitting reliable handling.