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Thick Film Integrated Decoupling Capacitor With Redundancy

IP.com Disclosure Number: IPCOM000063854D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Kopcsay, GV Reiley, TC [+details]

Abstract

This capacitor design permits deletion of defective areas, for improved yield, with acceptable electrical performance. Several approaches are possible for including power supply decoupling capacitors on a multichip module for use in high performance computers. Discrete capacitors can be mounted on the module top surface, with power planes in the module connecting them to the chips. Alternatively, integrated decoupling capacitors can reduce the effective inductance of the capacitor connection by embedding capacitor plates in the module directly under the chip.