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Thermal Conduction Module With Liquid Dielectric and Pistons With Surface Treatment for Enhanced Nucleate Boiling

IP.com Disclosure Number: IPCOM000063906D
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

A thermal conduction module (TCM) contains a boiling fluorocarbon, and pistons that contact semiconductor chips are coated with a material to promote nucleate boiling for enhanced heat transfer from the pistons to the fluorocarbon. The pistons also form part of the conventional heat transfer path from the chips to the metal hat that holds the pistons and from the hat to a water-cooled cold plate. A TCM has a ceramic chip carrier, an array of chips mounted on the carrier, and pistons that contact the chips and carry heat to a mechanical supporting structure that is called a "hat". The hat is attached to a water-cooled cold plate. Commonly the TCM is filled with helium which fills the gaps between the piston and the chips and thereby forms a parallel path for heat transfer.