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Material Patterning and Removal by Holographically Imaged Laser Radiation

IP.com Disclosure Number: IPCOM000063934D
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Latta, MR [+details]

Abstract

A method of etching patterns, for example, small holes, on samples, such as silicon disks, involves holographically imaged laser radiation. A hologram is created in a suitable material, such as photoresist, by using the arrangement shown in Fig. 1. A recording beam 10, such as a UV beam, is passed through a beam splitter 12. Beam 10A from the beam splitter 12 is reflected off of mirror 14 to the layer 16 of hologram material, such as photoresist. Beam 10B from the beam splitter 12 passes through a pattern mask 18 onto the hologram layer 16. The interference between beams 10A and 10B cause a hologram 16 with the desired pattern to be formed. The hologram 16 formed in Fig. 1 may be used in the arrangement shown in Fig. 2. An input excimer laser beam 20, having a wavelength close to that used in Fig.