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Vacuum Placement Device Disclosure Number: IPCOM000063961D
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-18

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Yu, SK [+details]


The device of the present invention simplifies the procedure for, and improves the accuracy in, placement of components for surface solder operations. The vacuum placement device 1 consists of a bottom plate 2 and a top plate 4. Two card locator pins 6 are provided to the bottom plate 2 to aid in registering the vacuum placement device 1 with respect to registering locating holes 8 on a circuit card 10. Four plate locator pins 12 are provided to the bottom plate 2. The locator pins 12 are positioned so as to align with alignment holes 14 in the top plate 4 to assure accurate positioning of the bottom plate 2 with respect to the top plate 4.