Browse Prior Art Database

Blind Via and Land Attach Connectors for 1.5D Enhancement

IP.com Disclosure Number: IPCOM000063964D
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Anderson, GE [+details]

Abstract

There is illustrated and described the marriage of an enhanced 1.5D connector to a raw card using a blind via/land attachment. The figures show the package. It comprises an epoxy glass carrier 2 having connector 3 attached thereto utilizing a blind via hole 4. The via 4 provides accuracy of alignment, internal plane connection 5, and support of connector 3 during soldering. A land area 6 or 7 may be used as an alternative to the conventional tab area 8 as the solderable surface. Surface tension created by the round land 6 maximizes wetting during the solder phase. Utilization of the land 6 or 7 versus the tab 8 provides additional real estate for circuit design. Internal connections 5 provide the same function as they fall below the conventional row of component vias 9. This provides greater function to the designer.