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Area Array Module I/O Pad to Printed Circuit Board I/O Pad Inter Connection Device Disclosure Number: IPCOM000063997D
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-18

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Related People

Knight, AD Winkler, PE [+details]


This article describes an interconnection device which uses contact spheres to make electrical contact between two similar terminations or I/O pads of an area array module and its corresponding printed circuit board array. Individual contact spheres 1 (Fig. 1), formed with collars 3 of an elastomeric material and plated 2 with a precious metal, such as NiAu, over a base conductor, such as Cu are placed in a pre-punched array carrier strip 4 and bonded to it by the collars 3. The array contact sphere size varies depending upon overall connector design. All contact sphere diameters in a given array are the same size. Contact "spheres" may be varied in design (Fig. 2) to gain some measure of contact wipe (W) when compressed under actuating force (F).