Browse Prior Art Database

Use of Power Plane for Signal Interconnections to Increase Wirability

IP.com Disclosure Number: IPCOM000064104D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Foster, RA Luhning, B [+details]

Abstract

Electronic assemblies utilize interconnection panels consisting of layers of glass cloth impregnated with an organic filler. Copper circuitry on the various layers provides power distribution and signal interconnection for electronic circuits. Signal interconnection lines are routed between a plurality of holes which are plated with copper to provide connection between planes. Conventional methodology confines signal conductors and power conductors to discrete planes in the laminate structure. However, utilization of signal conductors between through holes on power planes can significantly enhance the density of circuitry which can be contained in a given circuit panel. This placement of interconnections on the power plane will allow the full utilization of multiple wiring channels without blocking conductor paths.