Browse Prior Art Database

Pin Removal Process for Complex Boards

IP.com Disclosure Number: IPCOM000064120D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Babinski, S Barnhart, S Funari, J Rivenburgh, D [+details]

Abstract

Defective pins are easily and safely removed from complex boards by heating the pin to melt the solder. This is an improvement over the common practice of drilling the pin out, which may damage the board if the drill wanders, and may leave debris between the layers of the board. The figure shows that to effect this method of defective pin removal two electrical probes, upper probe 11 and lower probe 21, are held in contact with the ends of defective pin 1 to provide an electrical current path through the pin to heat and melt solder fillets 4 and 6. The upper end of defective pin 1 is clipped off at point 5, leaving a length of the pin at least equal to the thickness of board 2. A protective pad 8 is placed on the surface of the board, and upper ceramic bushing 10 is located with upper probe 11 bearing down on pin 1 at point 5.