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Water-Enhanced Selective Module Cooling for Air-Cooled Circuit Cards

IP.com Disclosure Number: IPCOM000064142D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Follette, DT Goodman, HA Simons, RE [+details]

Abstract

Recent developments in array chip storage capacities have created a significant power dissipation disparity between array chips and support (driver) chips. In order to continue to use card-on-board packaging technology which is desirable in all respects for memory array applications, it is necessary to externally enhance the cooling of the modules containing the support chips without compromising cooling of the array modules. The following innovative technique is an effective means for removing heat from several high-power dissipating modules situated with a majority of low-power dissipating modules on a circuit card. Illustrated in Fig. 1 is a heat pipe assembly, formed in the shape of a U.