Browse Prior Art Database

Water Cooling for Selected Modules

IP.com Disclosure Number: IPCOM000064147D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Arent, GR Myers, VH Natoli, TN Schmidt, RR [+details]

Abstract

A water-cooled cold plate is provided for a group of four or five high power circuit modules that are mounted on a circuit card that carries mostly low power modules that are air-cooled. The high power modules each have a chip carrier that carries one or a few chips. The cold plate is a rectangular plate of a suitable metal with a water-carrying tube crimped to its outer surface or formed internally. On the surface that faces the circuit card, the plate has four cavities that each receive one chip carrier. A metal contact is positioned between each chip and the opposite wall of the cavity for heat transfer. The chip carriers are bonded to the cold plate. The pins of the chip carriers are plugged into sockets in a circuit board and soldered in place.