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Continuous Process Equipment for Module and Component Removal Disclosure Number: IPCOM000064175D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

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Getto, A St. Germain, RJ [+details]


Effective removal of modules and/or components previously soldered to cards or boards is enhanced by avoiding their undue exposure to destructive temperatures during the removal process. Existing reutilization procedures employ a vapor phase soldering and/or flux removal technology that exposes the modules and components being salvaged to vapor temperatures of the order of 350-400ŒF within an enclosed chamber. Such temperatures are known to have a deleterious effect on plastic-encapsulated components and modules and would seriously impact their reclamation yields. This invention protects these modules/components during the vapor phase removal process without reducing the throughput for the operation.