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Dry Metal Spray Process for Application of Metal Films to Interfaces of Contact Chip Cooling Devices

IP.com Disclosure Number: IPCOM000064178D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Holihan, JE Landzberg, AH Oktay, S Paivanas, JA [+details]

Abstract

This publication relates to finned cooling modules such as described in [1,2,3]. The effective cooling of chips by contacting, conductive techniques is strongly dependent on achieving and maintaining low thermal interfacial resistances. A technique for accomplishing the latter objectives is described in [1,2,3]. In essence, the technique utilizes a low melting temperature bismuth alloy, such as OSTALLOY*, to provide not only a low resistance but also a self-healing mechanism should the interfaces degrade in the field because of environmental and mechanical effects. In the application of the above interface technique, it is important to apply the OSTALLOY in a thin layer with a thickness as uniform as possible.