Browse Prior Art Database

Mechanically-Sealed Circuit Module Construction

IP.com Disclosure Number: IPCOM000064195D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Lipschutz, LD [+details]

Abstract

In circuit modules employing semiconductor chips it is desirable to seal the chips hermetically within the container. The construction described seals a ceramic substrate with mounted chips to a cap by means of a compressible seal ring between the substrate and cap held in place by a clamping band and wedges. Fig. 1 shows a cross-section of the module as finally assembled. The seal ring 3, which can be made of metal, is compressed between the ceramic substrate 1 and the cap 2. The cap can be made of metal or ceramic and may be in a form suitable for carrying heat away from the module. The seal band 4, in combination with the wedges 5, exerts the necessary pressure to maintain the desired seal.