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Method of Depositing Metallic Conductors on Organic Carrier Materials

IP.com Disclosure Number: IPCOM000064198D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Pohl, G Seybold, D [+details]

Abstract

Copper in the form of a chelate compound is embedded in a resin compound. The copper is activated by thermally decomposing the organic copper compound by means of a laser beam that generates the conductor pattern in the organic phase. In an example, the glass fiber fabric is fed through a bath to be coated with epoxy resin. After preliminary drying at moderate temperatures in a drying tower, the coated fabric is fed through a further bath containing an organic copper compound, such as copper diphenyl, dissolved in the epoxy base material. In a further drying step, the organic phase is stabilized and preliminarily polymerized.