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Gas Panel Contact Pad Protector Solution

IP.com Disclosure Number: IPCOM000064394D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Carbone, MC Fasano, BV LaRose, JJ Sherk, TA [+details]

Abstract

A method to allow thin film copper electrodes to be heated to 430ŒC in air without oxidizing the electrodes has been developed. An aqueous solution of potassium silicate and a high pH wetting agent, when applied in a thin layer over a clean copper surface, will provide protection from oxidation. The coating has a low viscosity and can be wiped, dipped or sprayed onto the metal. A typical formula would comprise 1 ml potassium silicate, 2 drops of a high pH wetting agent, and 4 drops of water to lower the viscosity of the solution. The coating must be removed after firing, since it will react with the normal ambient atmosphere. It can be etched using a fluorine-based solution with appropriate additions to enhance the removal rate.