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Method for Applying Solder Paste on Non-Planar Boards

IP.com Disclosure Number: IPCOM000064398D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Curtis, DR Mitchell, RA Stankus, JJ [+details]

Abstract

A method to apply solder paste to printed circuits with attached contacts is described. Application of solder paste on printed circuits cards with subsequent reflow to attach components is done routinely in industry. Traditionally, the circuit boards are planar (i.e., flat) which makes them conducive to conventional screen or stencil printing. However, surface solder technology requires the application of solder paste on a planar card to which contacts have been attached to the card edge. Conventional screens, stencils, or masks cannot accommodate the approximately one-half inch protrusion of these contacts since the stencil must be within .030 inch of the surface to be coated. The contacts cannot be attached after paste application due to a solder melt point hierarchy and the problem of card stocking levels.