Browse Prior Art Database

TCM With Short Thermal Path Through Piston to Header and Wide Contact Area Between Header and Piston

IP.com Disclosure Number: IPCOM000064465D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

In a thermal conduction module (TCM), a metal piston which conducts heat from a chip to a header has the shape of a partial octahedron that is truncated to form upper and lower flat square surfaces and trapezoidal side surfaces. The lower flat surface contacts a semiconductor chip that is to be cooled. The header is shaped to receive the upper half of the partial octahedron and to make contact for heat transfer at the upper flat surface and at the upper trapezoidal sides. Beam springs are mounted on the lower surface of trapezoidal surfaces of the piston and push against the lower surface of the header to hold the piston in contact with the chip. The space between the piston and the header is filled with a heat transmitting material. The header is cooled, for example, by water.