Mechanism for Automatic Centering and Locating Square Substrates of Different Sizes
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-19
A technique is described whereby circuit substrates of various sizes are accurately positioned in fabricating work stations. A mechanism provides precise directional centering and eliminates the need to change tooling for different sizes of substrates. During the manufacture of multilayer ceramic (MLC) substrates, the use of automatic carriers requires precise registration of the substrates at the various work stations. Due to shrinkage factors of materials which form the substrate, the location of the circuit network pattern on the substrate cannot reliably be defined from the outer edges. Also, substrates come in a variety of sizes, requiring a common substrate registration mechanism. Otherwise, there would be a need to change the tooling, when processing one substrate size to another.