Browse Prior Art Database

EMC Shielding of Electronic Enclosures Utilizing Reactive Injection Molding Materials and Processes

IP.com Disclosure Number: IPCOM000064488D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Karr, PC [+details]

Abstract

A technique is described whereby the molding of plastic enclosures, used to house electronic components, also accomplishes electromagnetic shielding. The technique involving reactive injection molding (RIM) eliminates the cost of separately applying conductive coatings or platings to the enclosure to meet electromagnetic compatibility (EMC) requirements, by incorporating the EMC factors concurrent within the molding process. The RIM materials and processes, when used in the manufacture of enclosures, provide a conductive screen embedment, such as fabric or mat, by placing the conductive screen in the mold cavity before the injection of the liquid used in the RIM plastic system. The liquid flows through and around the conductor as it fills the mold, adhering to and embedding the conductor.