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Coating Removal Process

IP.com Disclosure Number: IPCOM000064495D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Ciotoli, RA Diamond, LP [+details]

Abstract

SYLGARD* Type II coatings are applied as a topseal on many metallized ceramic products. Once cured, this material is an effective environmental and alpha barrier, but it is also a barrier to any rework or analysis. The following process describes how all of the SYLGARD coating is removed from a substrate without adversely affecting the circuitry. Cermet resistors exhibit virtually no drift during silicone dielectric gel removal. 1) Place substrates into beaker of perchloroethylene. The substrates should not be stacked, and the substrates should be submerged by the perchloroethylene by at least one half inch. This step causes the gel to swell, decreasing its cohesion and facilitating its removal. The substrates should remain submerged for 3.5 hours.