Browse Prior Art Database

Top Seal for Large Modules

IP.com Disclosure Number: IPCOM000064515D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Infantolino, W Joseph, CA Knapp, DB Knieriem, JM Olshefski, FJ [+details]

Abstract

A top seal formulation protects C-4 modules from early thermal failure. An improved formulation for dense C-4 patterns consists of the following: Resin AI 10* 3.0 g. Solvent NMP 32.4 g. Diluent MOE 64.4 g. Silane Al100** 0.2 g. The formulation is prepared by dissolving constituents, filtering and needle dispensing on the substrate surface between device (silicon wafer underlaced with C4) and edge of substrate. Subsequent drying and curing at 100ŒC/60 min, 150ŒC/120 min, and 175ŒC/180 min. The shot size varies with module size. *Trademark of Amoco Chemicals Corporation. ** Trademark of Union Carbide Corporation.