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Multiple Geometry Field-Assisted Bonding Machine

IP.com Disclosure Number: IPCOM000064571D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Poley, NM [+details]

Abstract

Field-assisted bonding can be employed to generate conductor patterns on hot insulating substrates which contain mobile positive ions. This bonding is accomplished by feeding the conductor through a nozzle and generating the pattern on the substrate with an x-y table. However, this slow process is not consistent with low cost manufacturing. Other wire placement techniques are wrapping wire on a drum and then transferring same or utilizing warping methods common in the textile industry, neither of which are capable of producing fan-out patterns at the end of the substrate. This article proposes to combine these techniques in such a way that conductor configurations including fan-out patterns will be easy to fabricate.