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High Density Pinless Module Array Connector

IP.com Disclosure Number: IPCOM000064611D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Darrow, R Fiacco, VM Moring, F Tremblay, R VanBrunt, KB [+details]

Abstract

The high density pinless module array connector described in this article reduces the potential of a system being powered up without the module being engaged by having a visual indication of module actuation. This design does not rest on the board surface and, therefore, the large tolerance fluctuations associated with board manufacturing and assembly do not affect its functioning. This connector system employs a pinless module array, which consists of gold plated pads 11 mounted on a ceramic substrate (Fig. 1), a board stiffener 12, plastic spring housings 13, a printed circuit (PC) board 14, spring contacts 15 (Fig. 2), and a cam-driven actuation system 16 (Fig. 3). The plated-through holes in board 14 are drilled to comply with the module footprint 17 (Fig. 3). Spring housing 13 mounts to stiffener 12.