Double-Sided Thermal Conduction Module Cooling
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19
Utilizing the increased density of packaging VLSI/WSI (very large-scale integration/wafer scale integration) chips on substrates, the module I/O requirements are reduced. As a result of this reduction, the back sides of TCMs (thermal conductive modules) are allowed to use additional chips, which requires additional cooling. The cooling system shown in the drawing provides the necessary cooling requirements for this innovative multi-chip module. When both sides of the substrate 1 are populated with chips 2, the module 3 inputs/outputs 4 are provided by extending the substrate 5.