Browse Prior Art Database

Chip Carrier of Prefabricated Glass Layers Provided With Inner Vias and Conductors

IP.com Disclosure Number: IPCOM000064649D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Kaus, G Max, E Schmid, G [+details]

Abstract

For improving the performance of a multilayer chip carrier, which is essentially determined by the resistance and capacity of the signal lines, the chip carrier is made of prefabricated glass layers provided with conductors, applied by thin-film technology, and inner vias. Fig. 1 shows the base layer 1 with the pins 2 consisting of a sealing alloy and which are sealed into base layer 1. Base layer 1 is ground and polished on its top side for applying the first conductor pattern 3 (Fig. 3) for the supply voltage and signals in a known manner, for instance, in a lift-off step. The further layer 4 (Fig. 2) is produced from a prefabricated glass layer with connecting wires 5. Both sides of layer 4 are surface ground and polished.