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TCM With Hollow Cylindrical Piston With Multiple Radial Fingers Disclosure Number: IPCOM000064666D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue


Related People

Dessauer, RG Hwang, UP [+details]


In a circuit package called a thermal conduction module (TCM), semiconductor chips are mounted in an array on a chip carrier that forms one wall of an enclosure. The opposite wall of the enclosure is formed by a hat structure that has holes in which each carries a cylindrical piston that contacts one of the chips and conducts heat from the chip to the hat. The pistons are conventionally held in contact with the chips by means of springs that are located in the holes in the hat. The piston is formed by rolling a square of heat-conductive material into a hollow cylinder with a slight gap between the ends of the sheet. The cylinder is springy so that the cylinder has good contact with the sides of the hole in the hat.