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Sensing Chip Temperature in Helium Atmosphere on TCM by Monitoring Temperature-Sensitive Resistor With Self-Heating for Establishing Amount of Helium Present

IP.com Disclosure Number: IPCOM000064688D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Michalski, SJ Schmidt, RR [+details]

Abstract

A circuit package called a thermal conduction module (TCM) has an array of chips mounted on a chip carrier and enclosed in a helium atmosphere for good heat transfer to a water-cooled cold plate. The temperature of the chips is monitored by means of a temperature-sensitive resistor that is mounted on the chip carrier. The temperature of the resistor can be measured directly, and the temperature of the chips can be calculated by an expression that includes the rate at which heat is removed from the chip. (With reduced cooling, the chip temperature will rise in relation to the resistor temperature.) If the resistor temperature rises to a first value, an alarm is sounded, and if the temperature rises to a second value, the system is shut down automatically.