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Elastomeric Module-To-Board Connector System Disclosure Number: IPCOM000064692D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

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Desai, KV Knight, AD Winkler, PE [+details]


A solderless interconnection device makes electrical contact between the I/O pads of an area array module and its corresponding printed circuit board array with a disposable elastomeric multicontact. As seen in Figs. 1 and 2, the conductive member of this connector system consists of a noble metal, e.g., gold over nickel overplating 1 on a suitable base material 2 such as copper. The base material 2 is processed (by means such as mechanical rolling, chemical polishing, ion milling, etc.) prior to plating, to produce controlled asperities. Thus, multiple contact points 3 per contact are obtained, each of which produces high localized stress at the tips of each asperity during mating.