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Chip-Cooling Apparatus With Flexible Material Separating Cooling Fluid From Chip and With Metal Plate Contacting Chip and Attached to Flexible Material by Studs Extending Into Cooling Fluid

IP.com Disclosure Number: IPCOM000064703D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

Semiconductor chips are mounted in an array on a flat chip carrier and are cooled by a liquid that is held in a separate compartment located over the chips. The coolant compartment has a flexible wall of a dielectric material facing the chips. The wall is made of a dielectric material that has a high thermal resistance, and a metal plate is located between the wall and each chip. The metal plate is attached to the wall by studs that extend through the wall and into the coolant where they act as fins for an extended surface between the metal and the coolant. The metal plate can be similarly arranged to contact the top of an enclosed multi-chip module.