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Detection of an Insulating Film on Solder Pads and VLSI Interconnections

IP.com Disclosure Number: IPCOM000064711D
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Schick, JD Walsh, RH Wilson, HR [+details]

Abstract

Disclosed is a dual electrical contacting probe to detect the presence (and measure the thickness) or absence of an insulating film, typically formed by oxidation or contamination, on integrated circuit solder pads and VLSI (very large-scale integration) interconnections at the chip level electrical test phase. As shown in Figs. 1 and 2, one of the probes is sharp-tipped to penetrate the conductive material and the second is a flexible gold wire loop, of wire diameter about 0.001 inch, to make a gentle contact with the insulating material. The wire loop is affixed by means of a conducting cement to a tungsten carbide or other conductive material probe tip, which in turn is attached to a probe shaft. To detect the existence and measure the thickness of the insulating film on a solder pad, as shown in Fig.