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Improvement in Adhesion of Glass-Epoxy Laminates and Compatible Anaerobic Polymer

IP.com Disclosure Number: IPCOM000064747D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Gupta, MR Myers, DE [+details]

Abstract

In the manufacturing of printed circuit boards damage in the form of cracks and voids occurs during drilling of the epoxy laminates making up the board. A capping process is typically used to seal the cracks and voids. This article discloses use of an anaerobic polymer (suitable for glass-epoxy boards), e.g., LOCTITE PMS10E*, cured for 30-60 minutes at 160ŒC (preferably in vacuum) to repair the damage. This final curing step at a higher temperature than that conventionally used (110ŒC) improves the adhesion of the polymer to the epoxy, thereby effectively sealing any fiber fractures in the laminate. Curing the polymer at the higher temperature of 160ŒC, as compared to the 110ŒC curing temperature, results in a significantly higher scratch adhesion (as measured by the knife test) than that achieved at the lower temperature.