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Thermally Conductive Elastomer for Cooling

IP.com Disclosure Number: IPCOM000064793D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Mansuria, MS [+details]

Abstract

A technique is described whereby thermally conductive polymer elastomer materials are utilized to dissipate heat away from printed circuit planar boards. The elastomer materials provide a thermal conduction path between the board and its enclosure. Further enhancements can be provided through the use of heat-radiating offset fins positioned at the outside surface of an enclosure. Contemporary planar boards, used to mount computer circuit boards and components, are usually mounted at the bottom of an enclosure with an air gap between the board and enclosure. By using thermally conductive polymer elastomer material 10, as shown in the drawing, positioned between the board 11 and enclosure 12, heat will transfer from board 11 to enclosure 12 by conduction.