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Preparing Insulator Surfaces for Electroplating by Thermal Decompositon of Metal Carbonyls

IP.com Disclosure Number: IPCOM000064801D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Bergendahl, AS Duncan, BF Hakey, MC Horak, DV [+details]

Abstract

By the thermal decomposition of a metal carbonyl, a thin layer of conductive material is applied to the surface of a dielectric in preparation for electroplating. This is especially useful in acquiring an adherent, continuous, conductive film on insulating materials (e.g., plastics) of irregular shape. The chemical reaction: M(CO)x HEAT M + xCO is used wherein the metal carbonyl is decomposed by heat at the surface of the substrate to be coated, and the metal is left on the heated substrate while the CO gas is pumped away. The metal M may be any one of the several transition metals, e.g., Fe, Ni, W, Ta, Mo, etc. Since the decomposition temperature of the carbonyls is around 160ŒC, most insulators may be coated in this manner.