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Double-Layer Circuit Board on Anodized Aluminum

IP.com Disclosure Number: IPCOM000064831D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Mahmoud, IS [+details]

Abstract

A layer of anodized aluminum is provided underneath a double-layer circuit board to produce better thermal conduction and greater cooling of the components mounted on the underside of the circuit board. As shown in the drawing, an anodic layer 11 of anodized aluminum is formed on an aluminum board member 12. To this anodic layer 11 is bonded a circuit member 13 having copper circuit patterns on both sides thereof. Member 13 may be of any suitable material, such as KAPTON*. The KAPTON layer with its copper circuit patterns on both sides thereof is bonded to the anodic layer by suitable high molecular weight, high viscosity adhesive. Anodic layer 11 serves as a dielectric layer between the aluminum board member 12 and the circuitry on KAPTON layer 13.