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Determination of Dielectric Breakdown by Means of Fast Response Apparatus

IP.com Disclosure Number: IPCOM000064854D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Av-Ron, M Blusnavage, VA Shatzkes, M [+details]

Abstract

Reliability projection of electronic devices, in regard to dielectric integrity, is based on data derived from breakdown experiments conducted in the laboratory, but at accelerated stress. Acquiring such a data base necessitates, among other things, the capability of ascertaining the accurate value of the pertinent variable (i.e., time, voltage, temperature, etc.) at which the first breakdown event occurred. It is this type of data that would provide meaningful extrapolations vis-a-vis failure rates at use condition. The first breakdown event may give rise to a permanent short in the device under test, but may also be just a transient event that decays rather quickly.