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High Reliability Ceramic Chip Capacitor

IP.com Disclosure Number: IPCOM000064900D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Horstmann, RE Oberschmidt, JM [+details]

Abstract

Use of platinum as the electrode material in ceramic chip capacitors instead of palladium silver will substantially increase their reliability. The illustration shows the improved performance of the proposed invention compared to the conventional electrode material, palladium silver, commonly used by most manufacturers. The predominant failure mode for ceramic chip caps is a decrease in insulation resistance. This may cause the remainder of the circuit to cease operation or, through joule heating and resulting melting of the solder, cause burning of the circuit substrate. This failure mechanism is a result of a conducting path in cracks or voids in the dielectric region with the conducting path formed by partial, highly local, migration of the metallic electrode and formation of a bridge across oppositely charged electrodes.