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Wafer Flattening Disclosure Number: IPCOM000065020D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

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Elsner, G Jaerisch, W Makosch, G [+details]


Onto the back side of wafers or other substrates, a layer of polyamic acid is spun and cured. Stress built up in the layer by curing compensates for originally existing deformations of the substrates, thus ensuring substrate surfaces that are largely deformation-free. Alternatively, such deformations may be compensated for by vapor depositing an SiNx layer on the back side of the substrates. Example: Polyamic acid, dissolved in N-methyl pyrrolidone, was spun onto a wafer with a diameter of 8.25 cm.